Our provided Alloy Bonding Wire is a silver based alloy wire which aiming at top semiconductor package.It can meet the various requirements of IC, LED, power device packaging, and is able to replace the gold bonding wire partly in advanced packaging.
â³ It is used in LED, high-density packaging and other areas , can replace gold bonding wire after adjusting few of the related parameters .
â³ Less than 70-80% of the cost of gold wire with the same diameter
â³ Precise alloy smelting process can ensure excellent stability of the alloy wire. And No H2 and N2 forming gas in bonding process.
â³ The consistency and wide adaptability of 2nd joint and process of balling is stable.
â³ Its high strength can help improve the mechanical properties of the 1st bonding joint.
â³ Available to do Rework and Stack-chip.
â³ UPH be consistent with gold wire.
Diameter range: from 0.6mil--1.2mil
Clients can avail from us this range of Alloy Bonding Wire at most affordable prices.